Hitachi High-Tech Launches High-sensitivity and High-throughput

Tokyo, March 14, 2024 – Today, Hitachi High-Tech Corporation ("Hitachi High-Tech") announced the launch of the LS9300AD, a new system for inspecting the front and backside of non-patterned wafer surfaces for particles and defects. In addition to the conventional dark-field laser scattering detection of foreign material and defects, the LS9300AD is equipped with a new DIC (Differential Interference Contrast) inspection function that enables detection of irregular defects, even shallow, low aspect*1 microscopic defects. LS9300AD has the wafer edge grip method*2 and rotating stage currently used in conventional products to enabling front and backside wafer inspection.