New IO-Link Master Reduces Hardware Costs, Future-Proofs Pneumatic Valve Systems with IIoT Integration

NOVI, Mich. (Aug. 31, 2023) – Emerson has introduced a new Class A, IO-Link master that provides customers with a cost-effective solution for smart and analog sensor connectivity on the AVENTICS™ Series G3 Fieldbus platform. The G3 IO-Link Master is suitable for machine architectures with many sensors and pneumatic valves, and where it’s important to have reliable digital data communication between field devices, such as sensors and the machine controller. Application areas include automotive, tire manufacturing, food and beverage, packaging and metalworking.