Fujitsu Successfully Develops Easy to Handle, Flexible Nanotube Adhesive Sheet Technology with High Thermal Conductivity

2020-04-21
Carbon nanotubes have high thermal conductivity and represent a promising candidate for heat dissipation from heat sources including semiconductor devices. Nevertheless, the material remains difficult to handle due to its fragility, rendering it impractical for many purposes. To address this, Fujitsu has successfully developed a technology for laminating vertically aligned carbon nanotubes, while maintaining their original characteristics of high thermal conductivity and flexibility, as well as a technology for bonding them with sufficient adhesion. This technology facilitates the cutting and handling of carbon nanotube sheets, making it possible to use them as a heat dissipation material, for example, in automotive power modules for electric vehicles (EVs).
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