Panasonic Commercializes High Heat-Resistant Semiconductor Encapsulation Material for Power Devices
2015-10-04
Panasonic Corporation today announced that it developed a semiconductor encapsulation material for power devices that boasts the industry's top-class*1 heat-resistance performance (glass transition temperature) of 210°C and superior long-term reliability, and will start shipping samples of the products, CV8540 series, from October 2015.
