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Panasonic Launches Production of Molded Underfill Semiconductor Encapsulation Materials in Shanghai
2018/02/09

Panasonic will launch the mass production of molded underfill semiconductor encapsulation materials in Shanghai, China in response to the increased production of leading-edge semiconductor packages in the region. This added capacity will enable Panasonic to provide faster and more efficient service to customers in China.


Panasonic Industrial Devices Materials (Shanghai) Co., Ltd.

Osaka, Japan - Panasonic Corporation announced today that Panasonic Industrial Devices Materials (Shanghai) Co., Ltd. (PIDMSH) will start high-volume manufacturing of molded underfill (MUF)[1] materials for advanced semiconductor packages in March 2018 in response to the increasing demand for these products in China.

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