December 27, 2016
Osaka, Japan - Panasonic Corporation today announced that it has revised the prices of its copper clad laminates and mass laminations, with inner layer circuits (Panasonic product name: PreMulti) available as printed circuit board materials.
The price of copper foil, which is a raw material for copper clad laminates and mass laminations has been soaring against the backdrop of its globally tight demand-supply balance. In addition, the London Metal Exchange (LME) price, regarded as the price index for copper ingots, of which copper foil is made, has also been on rise, affecting the price of copper foil.
Panasonic has been making extensive company-wide efforts to absorb the increased raw material costs through manufacturing rationalization and cost reductions. However, absorbing the copper foil price increase through self-help efforts has its limit, and furthermore, in order to continue to ensure a stable product supply for customers, the company has decided to reflect part of the copper foil price increase in its product prices as shown below.